february 2010 doc id 10740 rev 5 1/8 8 emif02-usb03f2 2-line ipad?, emi filter including esd protection features 2-line, low-pass filter + 2-line esd protection high efficiency in emi filtering lead-free package very low pcb space occupation: < 2.80 mm 2 very thin package: 0.65 mm high efficiency in esd suppression (iec 61000-4-2 level 4) high reliability offered by monolithic integration high reduction of parasitic elements through integration and wafer level packaging complies with the following standards iec 61000-4-2 level 4 on external pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) iec 61000-4-2 level 1 on internal pins: ? 2 kv (air discharge) ? 2 kv (contact discharge) application esd protection and emi filtering for: usb otg port description the emif02-usb03f2 is a highly integrated array designed to suppress emi / rfi noise for usb otg (on-the-go) ports. the emif02-usb03f2 flip-chip packaging means the package size is equal to the die size. additionally, this filter includes esd protection circuitry which prevents damage to the protected device when subjected to esd surges up to 15 kv on external contacts. figure 1. pin layout (bump side) figure 2. schematic tm : ipad is a trademark of stmicroelectronics. flip chip (11 bumps) 3 id vbus d+ out d- out pup pd2 gnd pd1 d+ in d- in dz 2 a b c d 1 c line = 20 pf max. d+out d+in d-in d-out pd2 pd1 r2=33 r3=1.3k pup dz id vbus r1=33 emif02-usb03f2 r5=15k r4=17k www.st.com
characteristics emif02-usb03f2 2/8 doc id 10740 rev 5 1 characteristics table 1. absolute ratings (t amb = 25 c) symbol parameter and test conditions value unit v pp internal pins (d3, c3, c2, b2, b1): esd discharge iec61000-4-2, air discharge esd discharge iec61000-4-2, contact discharge external pins (d1, c1, a2, a3, b3): esd discharge iec61000-4-2, air discharge esd discharge iec61000-4-2, contact discharge 2 2 15 8 kv t j maximum junction temperature 125 c t op operating temperature range -40 to +85 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol parameters v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic impedance i pp peak pulse current c line input capacitance per line symbol test conditions min typ max unit v br i r = 1 ma 14 v i rm v rm = 3 v 0.2 a c line v line = 0 v, v osc = 30 mv, f = 1 mhz, measured in zero light condition 20 pf r 1 , r 2 tolerance 5 % 33 r 3 tolerance 5 % 1.30 k r 4 tolerance 5 % 17 k r 5 tolerance 5 % 15 k
emif02-usb03f2 characteristics doc id 10740 rev 5 3/8 figure 7. junction capacitance versus reverse voltage applied (typical values) figure 3. filtering measurement figure 4. analog crosstalk measurement 100k 1m 10m 100m 1g -4 0 -3 0 -2 0 -1 0 0 d+in d+out d-in d-out db f (hz) 100k 1m 10m 100m 1g -130 -120 -110 -100 -9 0 -8 0 -7 0 -6 0 -5 0 -4 0 -3 0 -2 0 -1 0 0 d-in d+out dz id db f (hz) figure 5. esd response to iec 61000-4-2 (+15 kv air discharge) on one input v in and on one output v out figure 6. esd response to iec 61000-4-2 (-15 kv air discharge) on one input v in and on one output v out in out v cl = 74 v v cl = 27 v 20.0 v / div. 10.0 v / div. 100 ns / div. 100 ns / div. in out v cl = -47 v 10.0 v / div. 10.0 v / div. 100 ns / div. 100 ns / div. v cl = -23 v 0 2 4 6 8 10 12 14 16 18 20 0123456789101112 c(pf) v line (v)
application information emif02-usb03f2 4/8 doc id 10740 rev 5 2 application information figure 8. application schematic figure 9. aplac model figure 10. aplac parameters r1 = r2 = 33 cline = 20 pf max. d+ d- vbus id d+ d+out d+in d-in d-out pd2 pd1 d- vbus id gnd gnd usb otg connector r2=33 r3=1.3k pup dz id vbus r1=33 3.3v usb otg xceiver emif02-usb03f2 r5=15k r4=17k bulk model = d02_usb03 r_33r bulk bulk port1 c2 50 r_1k3 c3 model = d02_usb03 a3 port2 bulk 50 bulk a2 model = d02_usb03 b2 r_33r r_15k d3 c2 bulk lbump c1 r_17k b1 bulk bulk model = d02_usb03_gnd c3 d2 c1 bulk bulk rbump d1 d1 bulk d3 bulk bulk b1 bulk b3 lbump rbump d2 lbump rbump lgnd rgnd b3 bulk cgnd b1 bulk b2 rs ls rs ls bulk rsubump cbump a3 bulk b2 bulk a2 bulk c3 bulk c2 c1 rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump bulk model = d02_usb03 r_33r bulk bulk port1 c2 50 r_1k3 c3 model = d02_usb03 a3 port2 bulk 50 bulk a2 model = d02_usb03 b2 r_33r r_15k d3 c2 bulk lbump c1 r_17k b1 bulk bulk model = d02_usb03_gnd c3 d2 c1 bulk bulk rbump d1 d1 bulk d3 bulk bulk b1 bulk b3 lbump rbump d2 lbump rbump lgnd rgnd d2 lbump rbump lgnd rgnd b3 bulk cgnd b1 bulk b2 rs ls rs ls bulk rsubump cbump rsubump cbump a3 bulk b2 bulk a2 bulk c3 bulk c2 c1 rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump rsubump cbump ls 950ph rs 150m r_33r 33 r_1k3 1.3k r_15k 15k r_17k 17k cz_usb03 11pf rs_usb03 1 cz_usb03_gnd 220pf rs_usb03_gnd 0.9 lgnd 50ph rgnd 100m cgnd 0.15pf lbump 50ph rbump 20m cbump 2.4pf rsubump 100m
emif02-usb03f2 ordering information scheme doc id 10740 rev 5 5/8 3 ordering information scheme figure 11. ordering information scheme 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 12. package dimensions emif yy - xxx zz fx emi filter number of lines information package x = resistance value (ohm) z = capacitance value / 10 (pf) or 3 letters = application 2 digits = version f = flip chip x = 2: lead-free, pitch = 500 m, bump = 315 m 1.44 mm 30 m 1.94 mm 30 m 315 m 50 500 m 500 m 650 m 65 220 m 220 m
ordering information emif02-usb03f2 6/8 doc id 10740 rev 5 figure 15. flip chip tape and reel specification note: more information is availa ble in the application notes: an1235:"flip chip: package description and recommendations for use" an1751: ?emi filters: recommendations and measurements? 5 ordering information figure 13. footprint figure 14. marking copper pad diameter: 250 m recommended, 300 m max. solder stencil opening: 330 m recommended solder mask opening recommendation: 340 m min. for 300 m copper pad diameter x y x w z w dot, st logo ecopack status xx = marking z = manufacturing location yww = datecode (y = year ww = week) dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 0.1 8 0.3 4 0.1 1.75 0.1 3.5 0.1 ? 1.5 0.1 0.73 0.05 xxz yww e st xxz yww e st xxz yww e st 2.04 1.58 table 3. ordering information order code marking package weight base qty delivery mode emif02-usb03f2 fu flip chip 4 mg 5000 tape and reel 7?
emif02-usb03f2 revision history doc id 10740 rev 5 7/8 6 revision history table 4. document revision history date revision changes 14-oct-2004 1 initial release. 25-oct-2004 2 figure 14. : flip chip marking dimensions updated. 27-oct-2004 3 minor layout update. no content change. 28-apr-2008 4 updated ecopack statement. updated figure 11 , figure 12 , figure 13 , figure 14 and figure 15. reformatted to current standards. 08-feb-2010 5 updated the maximum value of i rm in ta b l e 2 . updated figure 12 and figure 15 for die dimension reductions.
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